Shape Prediction of BGA Solder Joint and Its Reliability Optimization Design

ZHOU Wen-fan,TIAN Yan-hong,WANG Chun-qing

DOI: https://doi.org/10.3969/j.issn.1001-3474.2005.04.001

2005-01-01

Abstract:A scheme for predicting and analyzing solder interconnection joint shape and reliability was proposed.Through the variations of lower pads' diameters, the shapes of full array and peripheral array of BGA solder joints with different solder volumes were predicted,and 3-D finite element models were established.Using finite element method,the distribution characteristics of the stress and strain in solder joints under thermal cycle load were analyzed.Based on this, fatigue lives of solder joints with different solder volumes were predicted, and the optimum diameter ratios of lower pad to upper pad for these two kinds of BGA assemblies were suggested.