Effect of thermal load on the dynamic characteristic of panel

Tao CHEN,Min XU
DOI: https://doi.org/10.3969/j.issn.1006-3919.2014.01.004
2014-01-01
Abstract:A new method solving for thermal stress and thermal modals has been developed. The method takes geometrical nonlinearity into the formulation which is based on multi-variable finite element method. Thermal stress is calculated with nonlinear static finite element analysis by transforming the effect of temperature into thermal load. After the nonlinear stiffness matrix affected by thermal stress has been computed, a general eigenvalue analysis procedure could be performed to get the thermal modal and the corresponding frequencies by using the thermal stiffness matrix and mass matrix. Finally, the method of calculating thermal buckling problem is presented. Computation of thermal stress and thermal modal of a typical panel is compared with that of Nastran, of which the relative error is lower than 10%. The effect of thermal stress on characteristic of the panel is also analyzed.
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