3D Printing Acceleration Sensor Design Based on Photosensitive Resin Analysis

Chuan?qi LIU,Yu?long ZHAO,Ming?jie LIU,Yi?wei SHAO,Qi ZHANG
DOI: https://doi.org/10.3969/j.issn.1674-5558.2019.04.007
2019-01-01
Abstract:Silicon micromachining technology used in MEMS acceleration sensor has some shortages such as personal?ized customization and small batch production cost. The advantage of 3D printing technology lies in the free customization without moulds and the realization of low?cost product manufacture with multi?use of one machine. The development trend of 3D printing is to realize the manufacture of micro?nano?scale structure. In this paper, a 3D printing piezoresistive accelera?tion sensor structure is designed by using photocuring stereoforming technology. The sensor substrate is made of a high tem?perature resistant photosensitive resin, and a conductive carbon slurry is printed on the surface of the substrate by a screen printing process to form a strain gauge structure. To this end, the thermal and mechanical properties of high temperature re?sistant photosensitive resins are analyzed firstly. Through testing, the thermodynamic parameters such as the initial decom?position temperature of the photosensitive resin after curing are obtained. Secondly, by controlling the ultraviolet curing time of the photosensitive resin, a resin having a good Young’s modulus and bending strength is obtained, which provides the necessary data and important basis for the structure simulation optimization and fabrication process of the acceleration sensor. In addition, the structure of carbon slurry strain gauge is tested and the effective sensitivity coefficient is obtained. Through the above work, the way for the final realization of the 3D printing acceleration sensor is paved. It is helpful to the integration of 3D printing technology and MEMS sensor technology.
What problem does this paper attempt to address?