Abstract:A method of incorporating research is proposed on scratching and uniaxial tension based on molecular dynamics (MD) with embodied atom method (EAM) for single copper in this paper. The process of tri-pyramid diamond tool scratching the single copper on the (010) plane is simulated under different penetrated depths. The details of scratching process and uniaxial tension are depicted in atomic view. The phenomena of heal-up surface, dislocations and burr are shown after the workpiece is scratched and the principle of that is attempted to analyze. The defects of the surface and subsurface of the workpiece scratched are represented and analyzed by the perspective of dislocations and radial distribution function (RDF). Whereafter the uniaxial tensile simulation of the “real” workpiece after scratching is performed. The mechanism of deformation and the details of change under the uniaxial load are analysed through the stress-strain curve that is combined with the perspective of atom. From simulations results, it is found that the dislocations only occur on the surface and subsurface of workpiece at the small scratching depth, while the dislocations are nucleated and emitted in front of tool and beneath the tool under the deep scratching depth. Dislocations disappear when they propagate to the surface. After the tool escapes the workpiece, the atoms on surface of the workpiece scratched heal up to some extent by the inter force of atoms, while some of the pile-up atoms on surface of tool are attracted backwards surface of workpiece, then form the burr, and others of those atoms are absorbed on the tool’s surface. The number of defects from surface and inner of workpiece increase when the scratching depth is doubled. The order of crystal decreases, especially long range order. It is shown that the penetration depth into the workpiece during scratching affects both surface pile-up and residual defect generation that is important in assessing the change of material properties after being scratched. In the process of the simulation of uniaxial load, the yield stress decrease with the increasing depth of cutting, and dislocations are nucleated at the bottom of groove, especially at the position where the tool escaped nearby burr firstly, and dislocations at ∼45° are observed. It shows that groove is the source of the dislocations aroused. The break-up point is near to the middle of workpiece with increasing depth with groove.

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Large-area Fabrication of Highly Reproducible Surface Enhanced Raman Substrate Via a Facile Double Sided Tape-Assisted Transfer Approach Using Hollow Au-Ag Alloy Nanourchins.

Surface deformation of single crystalline copper on different nano-scratching paths

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Modeling and Experimental Study of Machining Outcomes when Conducting Nanoscratching Using Dual-Tip Probe on Single-Crystal Copper

Atomic Simulations of Tip-Based Nanomilling on Single-Crystal Copper

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Fabrication and characterization of Ag-Cu dendritic periodic array substrate for surface-enhanced Raman scattering

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Periodic nanostructures on single-crystal copper for SERS substrate fabricated by using AFM dynamic lithography

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Experimental and Theoretical Investigation of Crystallographic Orientation Dependence of Nanoscratching of Single Crystalline Copper.

Room-temperature Fabrication of Cu Nanobrushes As an Effective Surface-Enhanced Raman Scattering Substrate

Implementation of AFM Tip-Based Nanoscratching Process on Single Crystal Copper: Study of Material Removal State

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Fabrication of large scale uniform copper-island thin film for ultrasensitive surface enhanced Raman scattering

Incorporate Research on Scratching and Uniaxial Tension of Three-Dimensional Microconstruction Simulation Based on Molecular Dynamic