Influence of Organic Solvent Surface Protection on Diffusion Bonding of Pure Aluminum to Pure Nickel

Li Rui,Cao Jian,Wang Yifeng,Dai Xiangyu,Feng Jicai

2017-01-01

Rare Metal Materials and Engineering

Abstract:Diffusion bonding of pure aluminum to pure nickel by organic solvent surface protection was investigated at various temperatures. The interfacial microstructure of Al/Ni diffusion bonded joint was confirmed to be Al/Al3Ni2/Ni by scanning electron microscope, energy spectrum analysis and X-ray diffraction (XRD) analysis. The organic solvent was used to protect the "clean surface" against re-oxidation prior to diffusion bonding. Under optimum conditions, the joints with higher shear strength were obtained. As the temperature increases, the thickness of the reaction layers increases gradually. The highest shear strength obtained by organic solvent surface protection bonding is 17.83 MPa under 2 MPa for 60 min at 490 degrees C, which is 55% higher than those obtained by conventional diffusion bonding.