Microstructure and Strength of the Tib2 Cermet/Tial Joint Diffusion Bonded with Ni Interlayer

ZR Li,JC Feng,J Cao,YY Qian

2003-01-01

Abstract:Vacuum diffusion bonding of TiB2 cermet to TiAl -based alloys using Ni interlayer has been carried out at 1123similar to1323 K for 0.6similar to3.6 ks under 80 MPa. The effects of joining parameters on the microstructure of the joints and mechanical properties was investigated. The results showed that a TiAlNi2 intermetallic layer and two Ti, Al, Ni solid solution layers were formed at the interface of Ni/TiAl. The shear strength was 110 MPa with bonding temperature at 1223 K, bonding time for 1.8 ks and bonding pressure under 80 MPa.