Abstract:Higher contact resistance not only increases power consumption and temperature rise but also causes undesirable interconnectivity between electrode materials, which further influences the electrical lifespan and reliability of switching devices. However, relevant studies on the relationship between contact resistance and load force, and on the reduction of contact resistance by controlling the micro-structure of rough surfaces, especially for electrode materials with larger Sq (root mean square) values, are very limited. In this study, the contact resistance calculation method, based on classical Holm theory in combination with the elastic and plastic deformation, was reviewed. Then, typical curves of measured contact resistance and load force were analyzed and compared with the calculation results for smooth surfaces. Furthermore, experimental results for electrodes with bright and matt surfaces were compared. It was found that the average contact resistance of samples with matt surfaces was 0.162 mΩ for a load force of 5 N, which decreased by 18.52% compared to that of the bright surface. The standard deviation of the contact resistance greatly decreased to 0.008 mΩ for samples with matt surfaces, which indicated that the matt electrode surface could effectively produce low and stable contact resistance. In addition, the influences of the numbers and sizes of contact a-spots on the relationship between contact resistance and load force were investigated. It was found that denser asperities with smaller curvature radii for the matt surface were beneficial for lower contact resistance, even for the electrode material with larger Sq values. Finally, an empirical model of the contact resistance with error bands based on the experimental results was established and verified.

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