Simultaneous enhancement of thermal and dielectric properties of Ba0.8Sr0.2TiO3 and h‐BN co‐doped epoxy hybrid composites under high frequencies and temperatures
Taqi ur Rahman,Xiangrong Chen,Qilong Wang,Tianyin Zhang,Kai Yin,Muhammad Awais,Ashish Paramane
DOI: https://doi.org/10.1002/pc.28773
IF: 5.2
2024-07-13
Polymer Composites
Abstract:Graphical representation of testing and properties enhancement mechanism for the composites. Epoxy resin (EP) is widely employed in power systems and electronic devices due to its low cost and easy processing along with good insulative and adhesive properties. However, EP insulation properties are compromised at elevated frequencies and temperatures because of its negative temperature coefficient effect (NTC) and poor thermal characteristics. In this context, barium strontium titanate (BST‐60), a positive temperature coefficient (PTC) filler, and hexagonal boron nitride (h‐BN), a thermally conductive filler, both surface‐modified with dopamine, are added in EP to simultaneously improve thermal and dielectric insulation properties at high temperatures and high frequencies. This study finds that below the Curie point of BST, the insulating properties of h‐BN fillers significantly contributes to improving insulation properties. Conversely, above the Curie point, the insulating nature of BST fillers leads to an improvement in the insulation performance of composites. Furthermore, at elevated frequency and temperature, the nano h‐BN enhances thermal conductivity of EP by establishing a thermally conductive network, while micro‐BST suppresses the NTC effect of EP by regulating electrical resistivity above the Curie point. The Heywang model elucidates the PTC effect of BST fillers, while a proposed heat conduction‐dissipation mechanism explains the behavior of incorporated fillers at different temperatures. Highlights PDA‐modified Ba0.8Sr0.2TiO3 and h‐BN co‐doped epoxy composites are prepared. Negative temperature coefficient effect of epoxy is mitigated by PTC fillers. The optimal wt.% of filler enhances both dielectric and thermal properties. Dielectric properties are explored at high frequencies and temperatures. Optimized epoxy composites are suitable for high‐frequency applications.
polymer science,materials science, composites