Abstract:Study of the mechanical properties and curing kinetics based on hybrid‐filled light‐cured resins. Light‐cured polymer composites incorporating particle reinforcements have been adopted for a wide range of engineering applications. Nevertheless, micro‐filled composites exhibit insufficient strength despite good abrasion resistance. Conversely, nano‐filled counterparts possess enhanced strength but easily generate particle agglomeration. Hybrid filling has therefore been utilized in previous studies to combine the advantages of different components, but conclusive results have not been obtained. Within this study, the effects of hybrid filling on the strengthening mechanism and curing kinetics of light‐cured polymer composites were investigated by multi‐scale mechanical tests, in‐situ near‐infrared spectroscopy, scanning electron microscope, and finite element simulations. It was found that hybrid filling led to an average increase in Young's modulus by ~3.94%, the hardness by ~5.81%, the tensile strength by ~10.44%, and the degree of conversion by ~2.54% compared to micro‐filling at the same filler content. Besides, hybrid filling showed more reduced particle agglomeration compared to nano‐scale filling. Finite element analysis revealed that hybrid filling effectively enhanced the load‐bearing capacity of the matrix. Overall, the experimental results unveil a mechanism of particle reinforcement that can be extrapolated to various particle‐filled polymers across different length scales. These findings provide a versatile manufacturing technique for composites with heightened mechanical reinforcement and are expected to guide the application in the field of photo‐polymeric materials. Highlights Light‐cured polymer composites incorporating hybrid silica particles were prepared. The strengthening mechanism was investigated by multi‐scale mechanical tests. Hybrid filling could lead to an increase in material strength compared to micro‐filling. Hybrid filling exhibited reduced particle agglomeration in comparison to nano‐filling.

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