Abstract:Associate Editors CHOON KI AHN ZHIJUN LI PANOS J. ANTSAKLIS Korea University, Korea Univ. Sciences and Technology of China, China University of Notre Dame, USA TAMER BASAR KAMEL BARKAOUI LONG CHEN University of Illinois, USA Conservatoire Natl. des Arts et Métiers, France University of Macau, China YAN-JUN LIU XIANGHUI CAO DIMITRI P. BERTSEKAS Liaoning University of Technology, China Southeast University, China Massachusetts Institute of Technology, USA QINGLAI WEI C. L. PHILIP CHEN MOHAMMED CHADLI Chinese Academy of Sciences, China University of Macau, China Université de Picardie Jules Verne, France HUAGUANG ZHANG EI-SAYED M. EI-ALFY SHANGCE GAO Northeastern University, China King Fahd Univ. Petrol.&Minerals, Saudi Arabia University of Toyama, Japan GUANGJIE HAN QINGLONG HAN CESARE ALIPPI Dalian University of Technology, China Swinburne University of Technology, Australia Politecnico di Milano, Italy JIE ZHOU JIAN YANG FRANK L. LEWIS Tsinghua University, China Nanjing University of Science & Technology, China The University of Texas at Arlington, USA WEINAN GAO HONGYI LI JUN ZHANG Florida Institute of Technology, USA Guangdong University of Technology, China Denver University, USA HAIBO HE CHENGLIN LIU XIAOPING LIU University of Rhode Island, USA Chinese Academy of Sciences, China Carleton University, Canada XIN LUO WEI HE THOMAS PARISINI Chinese Academy of Sciences, China University of Science & Technology Beijing, China University of Trieste, Italy MARIOS POLYCARPOU GIUSEPPE FRANZè TENGFEI LIU University of Cyprus, Cyprus University of Calabria, Italy Northeastern University, China LEI SHU SHUN-FENG SU PEIYUN ZHANG University of Lincoln, UK University of Science and Technology, China Anhui Normal University, China FEI-YUE WANG XUEMIN SHEN XIAOXIANG NA Chinese Academy of Sciences, China University of Waterloo, Canada University of Cambridge, UK ZHEN SONG SHOUGUANG WANG HUI YU Siemens Corporation, USA Zhejiang Gongshang University, China Pouthmoth University, UK ZIDONG WANG DONALD WUNSCH II Brunel University London, UK Missouri University of Science&Technology, USA

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