Abstract:Biothermomechanics of skin is highly interdisciplinary involving bioheat transfer, burn damage, biomechanics and neurophysiology. During heating, thermally induced mechanical stress arises due to the thermal denaturation of collagen, resulting in macroscale shrinkage. Thus, the strain, stress, temperature and thermal pain/damage are highly correlated; in other words, the problem is fully coupled. The aim of this study is to develop a computational approach to examine the heat transfer process and the heat-induced mechanical response, so that the differences among the clinically applied heating modalities can be quantified. Exact solutions for temperature, thermal damage and thermal stress for a single-layer skin model were first derived for different boundary conditions. For multilayer models, numerical simulations using the finite difference method (FDM) and finite element method (FEM) were used to analyze the temperature, burn damage and thermal stress distributions in the skin tissue. The results showed that the thermomechanical behavior of skin tissue is very complex: blood perfusion has little effect on thermal damage but large influence on skin temperature distribution, which, in turn, influences significantly the resulting thermal stress field; the stratum corneum layer, although very thin, has a large effect on the thermomechanical behavior of skin, suggesting that it should be properly accounted for in the modeling of skin thermal stresses; the stress caused by non-uniform temperature distribution in the skin may also contribute to the thermal pain sensation.

Skin Pain Sensation of Epidermal Electronic Device/skin System Considering Non-Fourier Heat Conduction

Thermal management of epidermal electronic devices/skin system considering insensible sweating

Three-dimensional Thermomechanical Analysis of Epidermal Electronic Devices on Human Skin

Transient Thermomechanical Analysis of Epidermal Electronic Devices on Human Skin

Thermomechanical Analysis of Epidermal Electronic Devices Integrated With Human Skin

One-Dimensional Thermal Analysis of the Flexible Electronic Devices Integrated with Human Skin.

Skin Comfort Sensation with Mechanical Stimulus from Electronic Skin

Modeling of Skin Thermal Pain: A Preliminary Study

Skin Thermal Pain Modeling - A Holistic Method

Holistic thermomechanical model of skin thermal pain

Modeling of Nociceptor Transduction in Skin Thermal Pain Sensation.

Thermal analysis of ultrathin, compliant sensors for characterization of the human skin

Three-dimensional thermal analysis of rectangular micro-scale inorganic light-emitting diodes integrated with human skin

Modeling Skin Thermal Pain Sensation: Role of Non-Fourier Thermal Behavior in Transduction Process of Nociceptor.

Mathematical Modeling of Skin Bioheat Transfer

Non-Fourier analysis of skin biothermomechanics

Correlation between skin thermal pain and noxious stimuli

Biothermomechanics of Skin Tissues

Finite Element Analysis Model of Electronic Skin Based on Surface Acoustic Wave Sensor

Wireless, Battery-Free Epidermal Electronics for Continuous, Quantitative, Multimodal Thermal Characterization of Skin

Heat Emitting Damage in Skin: A Thermal Pathway for Mechanical Algesia