Abstract:Precise locating and correct classification of each defect in the image is the primary goal of surface defect detection (SDD). This is very similar to object detection, which seeks to predict a set of bounding boxes (Bboxes) and category labels for each object of interest. However, due to the fact that the category dependencies among defects are obviously different from those among general objects, the methods developed for object detection cannot be directly utilized for detecting defects. To address this issue, we proposed a category-related non-maximum suppression (CR-NMS) method. Different from most NMS methods, CR-NMS use Cover Percent (CoP), instead of Intersection over Union (IoU), to guide the Bbox regression. Moreover, a two-stage Bbox regression algorithm is proposed to remove the duplicate Bboxes. This algorithm works in a course-to-fine manner and takes the correlation between Bboxes into account. By this means, the CR-NMS can remove the duplicate Bboxes more effectively and is easy to embed in existing neural networks. A wafer surface defect dataset including 6,000 images and 11 defect categories was set up for training and evaluating our method. Experiments demonstrated that in the detectors, which were built on Faster R-CNN and RetinaNet with backbone ResNet-101, and YOLOX with backbone CSPDarknet, compared with STD NMS or Soft NMS, CR-NMS increased by 3.4%, 9.3%, and 5.5% on mean average accuracy (mAA), and their values were as high as 92.3%, 91.8%, and 90.8%, respectively. The same tests were also performed on dataset NEU-DET. The results showed that compared with STD-NMS and Soft NMS, the CR-NMS can also obviously improve the performance of all the detectors, and their mAA was improved by at least 1.2%.

Wafer Map Defect Pattern Classification Based on Convolutional Neural Network Features and Error-Correcting Output Codes

AI classification of wafer map defect patterns by using dual-channel convolutional neural network

Wafer map defect pattern detection method based on improved attention mechanism

Wafer Map Defect Classification Using Autoencoder-Based Data Augmentation and Convolutional Neural Network

A Wafer Surface Defect Detection Method Built on Generic Object Detection Network

Applying Data Augmentation and Mask R-CNN-Based Instance Segmentation Method for Mixed-Type Wafer Maps Defect Patterns Classification

A Deep Convolutional Neural Network-Based Multi-Class Image Classification for Automatic Wafer Map Failure Recognition in Semiconductor Manufacturing

Recognition and Classification of Mixed Defect Pattern Wafer Map Based on Multi-Path DCNN

Wafer map failure pattern classification using geometric transformation-invariant convolutional neural network

Wafer maps defect recognition based on transfer learning of handwritten pre-training network

Development of a Wafer Defect Pattern Classifier Using Polar Coordinate System Transformed Inputs and Convolutional Neural Networks

Advances in machine learning and deep learning applications towards wafer map defect recognition and classification: a review

A Deep convolutional neural network with residual blocks for wafer map defect pattern recognition

An Efficient Deep Learning Framework for Mixed-Type Wafer Map Defect Pattern Recognition

Wafer Map Defect Patterns Semi-Supervised Classification Using Latent Vector Representation

A Deep Convolutional Neural Network for Wafer Defect Identification on an Imbalanced Dataset in Semiconductor Manufacturing Processes

Convolutional Neural Network for Semiconductor Wafer Defect Detection

Semi-Supervised Framework for Wafer Defect Pattern Recognition with Enhanced Labeling.

Pre-trained CNN-based TransUNet Model for Mixed-Type Defects in Wafer Maps

Contrastive deep clustering for detecting new defect patterns in wafer bin maps

A Light-Weight Neural Network for Wafer Map Classification Based on Data Augmentation