TestDNA: Novel Wafer Defect Signature for Diagnosis and Yield Learning

Andrew Yi-Ann Huang,Katherine Shu-Min Li,Cheng-Yen Tsai,Ken Chau-Cheung Cheng,Sying-Jyan Wang,Xu-Hao Jiang,Leon Chou,Chen-Shiun Lee

DOI: https://doi.org/10.1109/ITC44170.2019.9000166

2019-01-01

Abstract:Wafer defect maps exhibit spatial failure pattern recognition for root cause analysis to improve defect diagnosis resolution and yield learning conventionally. We apply further product-driven test items to propose a wafer-level test methodology to generate a DNA-like wafer defect signature to identify wafer defects. Experience results show that our TestDNA are both effective and efficient, including the tight relation with traditional wafer defect patterns, high prediction accuracy over 90%, and improved lower non-pattern ratio from over 95% to around 11%.