Enhancement Of Solvent Resistance Of Polyimide Electrospun Mat Via The Uv-Assisted Electrospinning And Photosensitive Varnish

Lin Qi,Chen-Yu Guo,Meng-Ge Huang Fu,Yan Zhang,Lu-Meng Yin,Lin Wu,Jin-Gang Liu,Xiu-Min Zhang
DOI: https://doi.org/10.3390/polym11122055
IF: 5
2019-01-01
Polymers
Abstract:A new methodology for enhancing the solvent resistance of electrospun polyimide (PI) ultrafine fibrous mat (UFM) was investigated in the current work. For this purpose, a negative intrinsically photosensitive polyimide (PSPI) resin was prepared by the one-step high- temperature polycondensation procedure from 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) and alpha,alpha-bis(4-amino-3,5-dimethylphenyl)phenylmethane (PTMDA). The PI varnish, by dissolving the derived PI (BTDA-PTMDA) resin in N,N-dimethylacetamide (DMAc) at a solid of 20 wt %, was used as the starting material for the standard electrospinning (ES) and ultraviolet-assisted ES (UVAES) fabrications, respectively. The 365 nm wavelength of the high-pressure mercury lamp ultraviolet (UV) irradiation induced the photocrosslinking reaction in the PSPI mat. Solubility tests indicated that the PI UFM fabricated by standard ES procedure showed poor DMAc resistance, while the one by UVAES (PI-UV) exhibited excellent resistance to DMAc.
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