High Thermal Conductivity Nanocomposites Based on Conductive Polyaniline Nanowire Arrays on Boron Nitride

Yufeng Bai,Weifang Han,Chunhua Ge,Rui Liu,Rui Zhang,Lixia Wang,Xiangdong Zhang

DOI: https://doi.org/10.1002/mame.201900442

2019-01-01

Macromolecular Materials and Engineering

Abstract:With the development of soft electronics, conductive composites are garnering an increasing amount of attention. The electrical conductivity, thermal conductivity, and electrical stability of conductive composites are all very important. In particular, the thermal conductivity of conductive composites is critical to the stability of their conductive properties. However, little is reported on thermal management in conductive systems. Herein, sufficiently hydroxylated boron nitride nanosheets (BN-OH)@polyaniline (PANI) composite nanosheets with a high thermal conductivity and outstanding conductance stability are reported. PANI nanowire arrays are aligned vertically on BN-OH. This well-ordered nanostructure provides the means to form a good conductive and thermally conductive path. Notably, the composite through-plane thermal conductivity is 2.1 W m(-1) K-1(approximate to 1000% that of pure PANI) and that the resistivity of the composite is 1.38 Omega cm. Importantly, the resistivity of the composite remains unchanged after 1 h of work. The results show that this composite has prospective applications for use in soft electronics.