Abstract:An interface deformable piezoelectric bilayer beam model is proposed to study the electromechanical responses and interface stress distributions in an intelligent layered structure. Like most of current approaches in the literature, the layerwise approximation of electric potential is employed. While in contrast to the linear approximation where the induced electric field is ignored, the present model takes a quadratic variation of the potentials across the thickness, thus warranting an efficient and accurate modeling of the electric field. Completely different from the widely used equivalent single layer model, in which the whole laminate is assumed to deform as a single layer and thus has a smooth variation of the displacement field over the thickness, the present model considers each sublayer as a single linearly elastic Timoshenko beam perfectly bonded together and therefore with individual deformations. To ensure the continuity of deformations of two adjacent sublayers along the interface, two interface compliance coefficients are introduced, by which both the longitudinal and vertical displacement components along the interface of two sublayers due to the interface shear and normal stresses are taken into account. To assess the performance of the present model, a number of benchmark tests are performed for a piezoelectric bimorph and a piezoelectric-elastic bilayer beam subjected to (1) a force density normal to the upper face and (2) an electric potential applied to the top and bottom faces. A remarkable agreement achieved between the present solution and the finite element computations illustrates the validity of the present study. The present model not only predicts well the global responses (displacement, electric charge, etc.), but also provides excellent estimates of the local responses (through-thickness variations of electromechanical state, interface stress distributions, etc.) of the piezoelectric layered structures. The novel mechanics model of electroelastic layered structures presented can be used to efficiently and effectively characterize hybrid smart devices and develop/optimize new multifunctional materials.

The interface behavior of multiple piezoelectric films attaching to a finite-thickness gradient substrate

The Interface Behavior of a Thin Piezoelectric Film Bonded to a Graded Substrate

The Interface Behavior of a Thin Film Bonded Imperfectly to a Finite Thickness Gradient Substrate

Surface Effects On The Wrinkling Of Piezoelectric Films On Compliant Substrates

Interface Crack Problem of Functionally Graded Piezoelectric Materials: Effects of the Position of Electromechanical Impact and Gradient

Analysis and Guideline for Determining Piezoelectric Coefficient for Films With Substrate Constraint

Electromechanical Behavior of Interface Deformable Piezoelectric Bilayer Beams

Effect of couple stress at the interfaces of a nano-hole on the anti-plane electro-mechanical behavior

Influence of Substrate Deformation on Piezoelectric Displacement Measurement of Piezoelectric Film

Interface Crack Analysis of Piezoelectric Laminates Considering Initial Strain

Nonslipping Contact Between A Mismatch Film and A Finite-Thickness Graded Substrate

On Stress Singularity at the Interface Edge Between Piezoelectric Thin Film and Elastic Substrate

Interface Behavior of a Thin-Film Bonded to a Graded Layer Coated Elastic Half-Plane

Coupled Electromechanical Behavior of an Interface Electrode in A Piezoelectric Layer

Analytical modeling of the interface crack between a piezoelectric actuator and an elastic substrate considering shear effects

Analysis of an Interface Crack between Piezoelectric Semiconductor Coating and Elastic Substrate Structure

Dynamic strength around two interacting piezoelectric nano-fibers with surfaces/interfaces in solid under electro-elastic waves

An Interface Electrode Between Two Piezoelectric Layers

Piezothermoelastic analysis of thin films deposited on elastomeric substrates

Indentation responses of piezoelectric films ideally bonded to an elastic substrate

Contribution Of Substrate To Converse Piezoelectric Response Of Constrained Thin Films