Large Eddy Simulation of Film Cooling Flow from Round and Trenched Holes

Rui Hou,Fengbo Wen,Yuxi Luo,Xiaolei Tang,Songtao Wang
DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2019.118631
IF: 5.2
2019-01-01
International Journal of Heat and Mass Transfer
Abstract:The thermal and flow fields of round and trenched holes in the flat-plate model are investigated using large eddy simulation (LES) after validated against the experimental results. The focus is on understanding the influence of the trenched hole on downstream vortex structures at blowing ratios M = 0.5 and 1.0, which may benefit its effective application in cooling design. At M = 1.0, the transverse trench increases turbulent fluctuations and augments the complexity of vortex structures. Dynamic mode decomposition analysis is employed to extract the primary vortex structures. The dominant vortices of the trenched hole include K-H vortices and hairpin-like vortices near the centerline. This series of hairpin-like vortices present a larger spatial size than the hairpin vortex downstream of the round hole. Besides, they correspond to the downstream counter-rotating vortex pair in the mean flow field, which is detrimental to the local film cooling effectiveness. At lower blowing ratio M = 0.5, the previous spatially large hairpin-like vortices are replaced by a smaller one which alternatively appears on both sides of the centerline. In the mean flow field, each branch of the CVP is caught between two anti-CVPs. The suppression of adjacent vortices guarantees the attachment of coolant to the surface. (C) 2019 Elsevier Ltd. All rights reserved.
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