Abstract:Development of schemes to form complex three-dimensional (3D) mesostructures in functional materials is a topic of broad interest, thanks to the ubiquitous applications across a diversity of technologies. Recently established schemes in the mechanically guided 3D assembly allow deterministic transformation of two-dimensional structures into sophisticated 3D architectures by controlled compressive buckling resulted from strain release of prestretched elastomer substrates. Existing studies mostly exploited supporting substrates made of homogeneous elastomeric material with uniform thickness, which produces relatively uniform strain field to drive the 3D assembly, thus posing limitations to the geometric diversity of resultant 3D mesostructures. To offer nonuniform strains with desired spatial distributions in the 3D assembly, this paper introduces a versatile set of concepts in the design of engineered substrates with heterogeneous integration of materials of different moduli. Such heterogeneous, deformable substrates can achieve large strain gradients and efficient strain isolation/magnification, which are difficult to realize using the previously reported strategies. Theoretical and experimental studies on the underlying mechanics offer a viable route to the design of heterogeneous, deformable substrates to yield favorable strain fields. A broad collection of 3D mesostructures and associated heterogeneous substrates is fabricated and demonstrated, including examples that resemble windmills, scorpions, and manta rays and those that have application potentials in tunable inductors and vibrational microsystems.

Transformable, Freestanding 3d Mesostructures Based On Transient Materials And Mechanical Interlocking

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Remotely Triggered Assembly of 3D Mesostructures Through Shape‐Memory Effects

Electro-mechanically Controlled Assembly of Reconfigurable 3D Mesostructures and Electronic Devices Based on Dielectric Elastomer Platforms.

4D Electronic Systems: Transformable, Freestanding 3D Mesostructures Based on Transient Materials and Mechanical Interlocking (adv. Funct. Mater. 40/2019)

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Buckling and twisting of advanced materials into morphable 3D mesostructures

Mechanically Guided Hierarchical Assembly of 3D Mesostructures

Three-dimensional mesostructures as high-temperature growth templates, electronic cellular scaffolds, and self-propelled microrobots

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Wireless Microfluidic Systems for Programmed, Functional Transformation of Transient Electronic Devices

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3D morphable systems via deterministic microfolding for vibrational sensing, robotic implants, and reconfigurable telecommunication

Design and Fabrication of Heterogeneous, Deformable Substrates for the Mechanically Guided 3D Assembly

Mechanically-Guided Deterministic Assembly of 3D Mesostructures Assisted by Residual Stresses.

Self-assembled three dimensional network designs for soft electronics