Dynamic Response of Cracked Thermoelectric Materials

P. Wang,B. L. Wang,K. F. Wang
DOI: https://doi.org/10.1016/j.ijmecsci.2019.06.047
IF: 7.3
2019-01-01
International Journal of Mechanical Sciences
Abstract:Thermoelectric (TE) materials have a broad range of application in engineering such as cooling for thermal protection. Due to the brittle nature, TE semiconductors are prone to crack/voids under thermal shock. The investigation of the transient problem in cracked thermoelectric materials is essential for engineering applications. This paper describes a thermal-mechanical coupling method to analyze the transient response of the TE medium of finite size with an arbitrarily located inner crack. Based on the Fourier and Laplace transform, the crack problem is simplified into a system of singularity integral equations which can be solved by simple allocation. Besides, the results of this paper are verified through the finite element method (FEM). Furthermore, the effects of the crack position, crack's thermal and electrical permeability are discussed. Also, the effect of crack on the thermoelectric energy conversion efficiency is studied. Results show that the field concentrations at the crack tip become more significant when the crack is centrally located in the vertical direction. The electrical permeability of the crack has a limited influence on the energy conversion efficiency. However, as thermal permeability of the crack goes up, the efficiency falls significantly.
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