Thin Dielectric Sheet-Based Surface Integral Equation for the Scattering Simulation of Fractures in a Layered Medium

Wei-Feng Huang,Hanming Wang,Qiwei Zhan,Yuan Fang,Dezhi Wang,Runren Zhang,Qing Huo Liu
DOI: https://doi.org/10.1109/tgrs.2019.2914611
IF: 8.2
2019-01-01
IEEE Transactions on Geoscience and Remote Sensing
Abstract:Electromagnetic simulation of fractures has a growing importance in geophysical exploration, where the formation is usually inhomogeneous and modeled as a layered medium (LM). In this paper, we have developed the first integral-equation based solver to simulate the scattering of fractures straddling an LM. We refer to this solver as LM-thin dielectric sheet (TDS)-surface integral equation (SIE), since it is built on the TDS-based SIE and the LM Green's function (LMGF). Compared with the traditional finite element method (FEM) and volume integral equation (VIE), LM-TDS-SIE achieves excellent efficiency by taking advantage of the multiscale feature of fracture, rather than being restricted by its volumetric mesh. Good accuracy but the lower computational cost of LM-TDS-SIE is well demonstrated by investigating several typical examples, where reference results are obtained by the commercial software COMSOL. In addition to fractures, LM-TDS-SIE can also be used to simulate the scattering from other types of TDS.
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