Abstract:Hybrid fillers to build an efficient thermal conductivity network. Traditional integrated circuit (IC) packaging materials and printed circuit board substrate materials suffer from several limitations including low thermal conductivity, high coefficient of thermal expansion (CTE), and poor dielectric properties. Although significant efforts have been made to enhance these properties, achieving a single composite system with simultaneous high thermal conductivity, extremely low CTE, and dielectric loss remains a formidable task. In this study, we propose a hybrid polymer composite system that addresses these challenges. Our approach involves utilizing a thermosetting polyphenylene oxide (PPO) as the resin matrix, while incorporating boron nitride (BN) sheets with high thermal conductivity and alumina (Al2O3) spheres with favorable fluidity as fillers. To optimize the composite properties, the filler surfaces are modified using dopamine and silane coupling agents, ensuring proper interface control. The composites exhibit significant improvements in thermal conductivity, reduced dielectric loss and CTE, while maintaining excellent processibility. Specifically, with a composition of 25 vol% BN and 25 vol% Al2O3, the thermal conductivity of the composite reaches 2.18 W·m−1 K−1, surpassing neat PPO resin by a factor of 10.9. Simultaneously, the CTE decreases from 2.27% to 1.18% between 50 and 260°C, and the dielectric loss reduces from 0.0024 to 0.0011 at 10 GHz, as compared to neat PPO resin. Highlights The reported novel hybrid composite offers a promising solution to the limitations of traditional IC packaging materials. The reported hybrid composite exhibits significantly improved thermal conductivity, ultralow dielectric loss, and reduced coefficient of thermal expansion, while maintaining excellent processibility. The thermal conductivity of the composites reaches 2.18 W·m−1 K−1, surpassing that of the neat resin by a factor of 10.9, meanwhile the dielectric loss is as low as 0.0011 at 10 GHz, which is extremely difficult to achieve simultaneously for thermosetting polymer composites. Synergetic effects were realized with the hybridization of fillers with different dimensionality, and proper filler surface modification.

Boron Nitride Nanosheets Endow the Traditional Dielectric Polymer Composites with Advanced Thermal Management Capability

Enhanced Thermal Conductivity of Dielectric Polydimethylsiloxane Composites by Size-Controllable Boron Nitride Nanosheets

Polyphenylene oxide/boron nitride–alumina hybrid composites with high thermal conductivity, low thermal expansion and ultralow dielectric loss

Highly thermal conductive and electrical insulating polymer composites with boron nitride

Enhanced thermal conductivity in epoxy nanocomposites with hybrid boron nitride nanotubes and nanosheets

Self-Assembled Boron Nitride Nanotube Reinforced Graphene Oxide Aerogels for Dielectric Nanocomposites with High Thermal Management Capability

Polyhedral oligosilsesquioxane-modified boron nitride nanotube based epoxy nanocomposites: An ideal dielectric material with high thermal conductivity

Synchronously enhancing thermal conductivity and dielectric properties in epoxy composites via incorporation of functionalized boron nitride

Thermal Conductive Composites Reinforced Via Advanced Boron Nitride Nanomaterials

Aluminum Borate/Boron Nitride Nanosheet Fibers for Enhancing the Thermal Conductivity of Polymer Composites

Simultaneously enhanced dielectric properties and through-plane thermal conductivity of epoxy composites with alumina and boron nitride nanosheets

Highly efficient thermal conductivity of polyarylene ether nitrile composites via the introduction of hybrid fillers and tailored cross-linked structure

Preparation of Polymer Composites with High Thermal Conductivity by Constructing a “double Thermal Conductive Network” Via Electrostatic Spinning

Silver Nanoparticle-Enhanced Three-Dimensional Boron Nitride/Reduced Graphene Oxide Skeletons for Improving Thermal Conductivity of Polymer Composites

Enhance the thermal conductivity and maintain insulation property of epoxy via constructing a three-dimensional network by doping hexagonal boron nitride and carbon nanofiber

Boron nitride nanosheets/epoxy nanocomposites with high thermal conductivity and high dielectric constant for energy storage applications

Alkylated modified boron nitride nanosheets/polyimide composite films with advanced thermal conductivity and low dielectric constant

Synergetic enhancement of thermal conductivity by constructing BN and AlN hybrid network in epoxy matrix

Highly Thermally Conductive Yet Electrically Insulating Polymer/Boron Nitride Nanosheets Nanocomposite Films for Improved Thermal Management Capability.

Construction of boron nitride nanosheets-based nanohybrids by electrostatic self-assembly for highly thermally conductive composites

Scalable Polymer-Infiltrated Boron Nitride Nanoplatelet Films with High Thermal Conductivity and Electrical Insulation for Thermal Management