Recognition and Classification of Wire Bonding Joint via image Feature and SVM Model

Zhili Long,Xing Zhou,Xiaobing Zhang,Rui Wang,Xiaojun Wu
DOI: https://doi.org/10.1109/TCPMT.2019.2904282
2019-01-01
Abstract:Recognition and classification for wire bonding joint are important to quality assurance in semiconductor device manufacturing. In this paper, a precision recognition and classification system for bonding joint of ultrasonic heavy aluminum wire based on image feature and support vector machine (SVM) is presented. This system consists of feature extraction from images and classification model. In f...
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