Abstract:Synchronous measurement of full-field temperature and deformation at high temperature especially more than 1273 K is of much significance especially for part applications of turbine structures and materials. Non-contact optical methods attract more and more attention, however, current methods all face different challenges, such as strong light reflection on the surface of the specimen, disturbing radiation from environment, complex equipment setup, limited measured temperature not higher than 900 °C and so on. In this work, we develop an innovative technique to overcome some current problems. The measurement system employing an ultraviolet (UV) imaging system is composed of a scientific complementary metal oxide semiconductor (sCMOS) camera, a lens and a UV bandpass filter. The UV bandpass filter was used for thermal radiation elimination to acquire high quality images at elevated temperatures for deformation field calculation suitable for digital image correlation (DIC) method. The UV sensitive sCMOS camera without using active illumination was employed to collect enough UV radiation energy and eliminate the interference of the external ambient light, which is applicable for high accuracy temperature field measurement. Our system can realize the synchronous capture of image and temperature acquisition with passive UV imaging system at temperature not lower than 1473 K. The feasibility of the method was verified through heating molybdenum (Mo) and Ni-based superalloy IC21 materials. The temperature fields of Mo measured by the established imaging system up to 1835 K with error less than 0.25% showed the effectiveness for temperature measurement. The estimated deformation and temperature field of Ni-based superalloy IC21 up to 1473 K with measured temperature error less than 0.5% demonstrated well the great potential of the UV imaging system in simultaneous measurement of temperature and deformation fields at elevated temperatures.

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