Preparation of Copper Surfaces with Controlled Wettability Through the Molecular Self-Assembling Process

Du Ying,Chen Haijie,Cheng Zhongjun,Lai Hua,Zhang Naiqing,Sun Kening
DOI: https://doi.org/10.7503/cjcu20130705
2014-01-01
Abstract:We report a novel method for the fabrication of copper surfaces with controlled wettability. Through modification of the nanostructured copper substrates with mixed thiol molecules of HS(CH2)(9)CH3 and HS(CH2)(11)OH, surfaces with controlled wettability from superhydrophobicity to superhydrophilicity can be achieved by simply controlling the concentration of HS(CH2)(11)OH in the modified solution. The controllability of the surfaces wettability can be ascribed to the combined effect of the surface chemistry variation and the hierarchical micro/nanostructures on the substrates. Especially the presence of hierarchical micro/nanostructures, which can provide a better control of the surface wettability between the two extremes: superhydrophobicity and superhydrophilicity.
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