Thermal Analysis and Design of Electronic Equipments
齐永强,何雅玲,张伟,郭进军
DOI: https://doi.org/10.3969/j.issn.1004-373X.2003.01.027
2003-01-01
Abstract:The development of thermal analysis and design of Electronic Equipments are described Based on the selected cooling method, cooling technical are applied on equipment Thermal simulation design is presented
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