Abstract:Metallization techniques based on electroless plating are used to coat SiCp/Al composite materials. The directly palladium chloride (PdCl2) solutions in HCl is used to render the surface of such non-conductive substrates catalytically active towards metal deposition in the electroless plating solution. The microstructures of Ni-coated composites provided by scanning electron microscope (SEM) bring light into the palladium activation and electroless coating process. Also, X-ray photoelectron spectroscopy (XPS) and Line-scan have allowed to monitor the chemical and compositional surface modifications of activated and coated SiCp/Al composites, as well as to understand the mechanisms of the catalyst (palladium species) chemisorption on the composites surface and the interaction mechanisms of Ni layer with the SiCp/Al composites. The experimental results show that a nickel-substrate bonding action takes place during plating. Ni atom existing on the surface of the composites can partially obtain electrons from metals Al of the SiCp/Al composites when the substrate is embedded in the Ni layers, that is, the orbital interaction through the mutual overlap of the electronic orbits does exist in the interfacial regions between the coated Ni atoms and composites substrate instead of the mechanical-interlocked form. On the basis of the evidence, a model of electroless Ni deposition on SiCp/Al composites is submitted including Pd activation and Ni deposition processes to describe the formation of catalytic centers and the growth of deposited layer. The deposition model reveals that metal-substrate bond plays an important role in the high adhesion strength between the Ni coatings and the composites.

Communication-Reaction Processes In Electroless Pd Deposition On Ni-P Surfaces Utilizing Formic Acid As Reducing Agent

Electrooxidation of Formic Acid on Pd-Ni Alloy Film Electrode-The Effect of Dealloying

On the Mechanism of Electroless Ni‐P Plating

Electrochemical Behavior and Electrowinning of Palladium in Nitric Acid Media

Electrochemical Behavior of Nanostructured Fe-Pd Alloy During Electrodeposition on Different Substrates

Formic Acid Electrooxidation on Palladium Nano-Layers Deposited onto Pt(111): Investigation of the Substrate Effect

Electrodeposited PtNi Nanoparticles Towards Oxygen Reduction Reaction: A Study on Nucleation and Growth Mechanism

Electroless Ni-Fe Alloy Depositions Using DMAB and NaPH2O2 as a Reducing Agent

Fe-based Surface Activator for Electroless Nickel Deposition on Polyester: Application to Electromagnetic Shielding

3D-nanoarchitectured Pd/Ni catalysts prepared by atomic layer deposition for the electrooxidation of formic acid

Electrodeposited PdNi2 alloy with novelly enhanced catalytic activity for electrooxidation of formic acid

Study on Electrochemical Properties of Palladium in Nitric Acid Medium

Research on process of palladium-free activation and deposition for electroless nickel plating on SiCp/Al composites

Novel Pd-Catalyzed Electroless Au Deposition Method using a Sulfite Solution

Feasibility Study on the Electrochemical Reductive Decomposition of PFOA by a Rh/Ni Cathode.

Nanoporous PdNi Alloy Nanowires As Highly Active Catalysts for the Electro-Oxidation of Formic Acid.

Model of electroless Ni deposition on SiC/Al composites and study of the interfacial interaction of coatings with substrate surface

Ultrasonic-assisted Synthesis of Pd–Ni Alloy Catalysts Supported on Multi-Walled Carbon Nanotubes for Formic Acid Electrooxidation

Carbon Supported Pd-Pt-Cu Nanocatalysts for Formic Acid Electrooxidation: Synthetic Screening and Componential Functions

Electrocatalytic Oxidation of Formic Acid on the Carbon Supported Pd-Ni Alloy Nanoparticles

Palladium Particles Modified by Mixed-Frequency Square-Wave Potential Treatment to Enhance Electrocatalytic Performance for Formic Acid Oxidation