Comparison of high-speed shear properties of low-temperature Sn-Bi/Cu and Sn-In/Cu solder joints
Qin Wang,Shanshan Cai,Shiyu Yang,Yongjian Yu,Yongkang Wan,Jubo Peng,Jiajun Wang,Xiaojing Wang
DOI: https://doi.org/10.1007/s10854-024-12302-3
2024-03-16
Journal of Materials Science Materials in Electronics
Abstract:To study the high-speed shear properties of low-temperature solders, we select four groups of samples of Sn– x Bi ( x = 22, 30 wt%) and Sn− x In alloys ( x = 18, 22 wt%) with the melting temperature ranging from 190 to 200 °C. High-speed shear test results show that the shear strength of Sn–Bi/Cu solder joints is much higher compared to Sn−In/Cu solder joints, but their displacement is much lower. Consequently, the shear energy of Sn–Bi solders is less than half of the shear energy of Sn−In solders. This variation can be attributed to various fracture modes controlled by alloying element's characteristics. Sn− x Bi/Cu solder joints containing β-Sn, intrinsic brittle Bi phase and Cu 6 Sn 5 exhibit brittle interfacial fracture, while Sn− x In/Cu solder joints containing single γ-InSn 4 phase and Cu 6 (Sn, In) 5 show ductile fracture (e.g., Sn−22In/Cu) and part of mixed fracture (e.g., Sn−18In/Cu). This reveals that toughness of soft γ-InSn 4 phase is much better than that of microstructure containing β-Sn and intrinsic brittle Bi phases. Furthermore, for Sn–Bi solders, the quantity of brittle Bi-rich phase in the fracture surface is proportional to Bi content in alloys, leading to lower strength of Sn−30Bi/Cu solder joints. While for Sn−In solders, compared to 18In/Cu, 22In/Cu solder joints contain more Cu 6 (Sn, In) 5 IMCs in the matrix and thicker interfacial IMCs, it still exhibits higher shear energy under high-speed shear tests. This may be attributed to the fact that increasing In content not only makes the matrix softer but also coordinates with the deformation of interfacial IMC. The study provides a guidance for the development of low-temperature solder alloys with superior toughness.
engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied