Abstract:High reliable packaging materials are essential for wide band-gap power devices due to the thermal and mechanical stresses arising from extreme environmental conditions. In this study, two-dimensional pure Cu mesh or Cu–10Ni (wt.%) alloy mesh reinforced SAC305 composite solders were employed to create solid-liquid interdiffusion (SLID) soldering of Cu substrates at 250 °C. The microstructure evolution behavior of the soldering seam was investigated based on EPMA and EBSD characterizations, and the strengthening mechanism of the joint was discussed. Results showed that the pure Cu mesh reacted slowly in the Sn matrix and large-sized Cu6Sn5 grains were formed in the solder seam; while for joints using Cu–10Ni alloy mesh, the addition of Ni causes the Cu–Ni mesh to quickly dissolve and promote the formation of the fine-grained (Cu,Ni)6Sn5 phase. Increasing the mesh number of Cu–10Ni alloy skeleton could enhance the metallurgical reaction rate of the soldering seam and the grain-size reduction of the (Cu,Ni)6Sn5 phase; ultimately, the joints were completely composed of fine-grained (Cu,Ni)6Sn5 phase and reaction-residual Cu–10Ni skeletons. The refining mechanism of the (Cu,Ni)6Sn5 grains was discussed in detail. The shear strength of the Cu alloy joints varied with changing alloy skeletons and soldering time, and the joint soldered with 300 mesh Cu–10Ni skeleton for 210 s obtained the highest shear strength of 47.8 MPa. The grain boundary strengthening effect of fine-grained (Cu,Ni)6Sn5 phase, synergized with the toughening effect of the alloy skeleton, ultimately achieving highly reliable joints.

Si/Si Bonding Based on Self-Propagating Exothermic Reaction

Study on the Microstructure of Si/solder/Si Joint Based on Al/Ni Self-Propagating Exothermic Reaction

Bonding Silicon Wafers with Reactive Multilayer Foils

Aluminum-coated silicon wafer bonding with tin intermediate layer

Interfacial reaction mechanism of SiC joints joined by pure nickel foil

Solidification Microstructure of Tin-Based Solder in the Rapid Cooling Condition

Low Temperature Silicon Wafer‐to‐Wafer Bonding with Nickel Silicide

Study of Fusion Thickness of Tin Solder Heating by Self-Propagating Exothermic Reaction

Microstructure and Properties of Porous Si3N4/Dense Si3N4 Joints Bonded Using RE-Si-Al-O-N (RE = Y or Yb) Glasses

High-temperature Resistant Interconnections Formed by Ni Nanoparticles/Al Micro-particles Composite Paste for SiC Power Device Application

Microstructure and Properties of Porous Si3N4/Dense Si3N4 Joints Bonded Using RE–Si–Al–O–N (RE = Y or Yb) Glasses

Investigations of Silicon Wafer Bonding Using Thin Al and Sn Films for Heterogeneous Integration

BONDING OF Si3N4 CERAMIC WITH Al-Ti AND Al-Zr ALLOYS IN AIR

Microstructural and Micromechanical Characteristics of Tin-Based Solders Under Self-Propagating Exothermic Reaction Heating

Accelerated solid-liquid interdiffusion bonding of Cu joint using a Cu10Ni alloy mesh reinforced SAC305 composite solder

Terminal Sinter-Bonding Using Silver Paste for Aluminum Nitride Heater

The Influence of Heat Transfer Boundary Conditions on the Fusion Zone Size of Sn Solder under Localized and Rapid Heat Source

Low-temperature joining of alumina ceramic and nickel by Al-Ni self-propagating nanofoil

Diffusion bonding behaviour of Nb–Si and TiAl alloys by spark plasma sintering

Heat-resistant Joints of Si3N4 Ceramics with Intermetallic Compounds Formed in Situ

Investigations of Silicon Wafer Bonding Utilizing Sputtered Al and Sn Films