Abstract:The analytical solution is derived for the plane strain stress field around a cylindrical void in a hexagonal close-packed single crystal with three in-plane slip systems oriented at the angle π/3 with respect to one another. The critical resolved shear stress on each slip system is assumed to be equal. The crystal is loaded by both internal pressure and a far-field equibiaxial compressive stress. The deformation field takes the form of angular sectors, called slip sectors, within which only one slip system is active; the boundaries between different sectors are radial lines. The stress fields are derived by enforcing equilibrium and a rigid, ideally plastic constitutive relationship, in the spirit of anisotropic slip line theory. The results show that each slip sector is divided into smaller regions denoted as stress sectors and the stress state valid within each stress sector is derived. It is shown that stresses are unique and are continuous within stress sectors and across stress sector boundaries, but the gradient of stresses is not continuous across the boundaries between stress sectors. The solution shows self-similarity in that the stresses over the entire domain can be determined from the stresses within a small region adjacent to the void by invoking certain scaling and symmetry properties. In addition, the stress state exhibits periodicity along logarithmic spirals which emanate from the void. The results predict that the mean value of in-plane pressure required to activate plastic deformation around a void in a single crystal can be higher than that necessary for a void in an isotropic material and is sensitive to the orientation of the slip systems relative to the void.

ANALYSIS OF CRYSTAL SLIP AND STRESS FIELD IN BICRYSTAL WITH AND WITHOUT A VOID IN THE CRAIN BOUNDARY

Analysis of crystal slip and stress field in bicrystal with and without a void in the grain boundary

On the crystallographic study of growth characterization of isolated void in the grain boundary

Creep Behavior and Life Assessment of Anisotropic Bicrystals with A Void and Without Void in Different Kinds of Grain Boundaries

Elastic-plastic Stress Distribution Near Grain Boundary in Anisotropic Bicrystals and Tricrystals Considering Two Kinds of Grain Boundaries

The Stress Characteristics Near to the Grain Boundaries of Bicrystal and Tricrystal Specimens

Non-uniform Stress Field and Stress Concentration Induced by Grain Boundary and Triple Junction of Tricrystal

Grain boundary effects on the inelastic deformation behavior of bicrystals

Study on Creep Behavior of the Bi-Crystal with or Without Void in the Grain Boundary

Study on the Growth Behavior of Voids Located at the Grain Boundary

Cylindrical void in a rigid-ideally plastic single crystal III: Hexagonal close-packed crystal

Influence of Crystallographic Orientation on Growth Behavior of Spherical Voids

Cylindrical Void in a Rigid-Ideally Plastic Single Crystal. Part I: Anisotropic Slip Line Theory Solution for Face-Centered Cubic Crystals

Effects of Crystallographic Orientation on Void Growth and Coalescence

Arrangement and Decomposition of Grain Boundary Dislocations: Two-Mode Phase-Field Crystal Simulation

Atomistic Simulation Analysis of the Effects of Void Interaction on Void Growth and Coalescence in a Metallic System

Tensile Deformation Behavior of Copper Bicrystal with Perpendicular Grain Boundary

Simulation of Lattice Orientation Effects on Void Growth and Coalescence by Crystal Plasticity

Crystal Plasticity Based Investigation of Micro-Void Evolution under Multi-Axial Loading Conditions

Cylindrical void in a rigid-ideally plastic single crystal II: Experiments and simulations

FEM Simulation of Void Coalescence in FCC Crystals