Infrared Detection Tester for Electronic Circuit Fault

YANG Xian-ming,YE Yu-tang,FANG Liang,WU Yun-feng,CHENG Zhi-qiang
DOI: https://doi.org/10.3969/j.issn.1007-2276.2006.03.003
2006-01-01
Infrared and Laser Engineering
Abstract:The TIP-I Electronic Circuit Fault Tester was developed by use of infrared thermal imaging,image processing,image fusion and electronics technology.The tester could be used to detect and isolate electronic circuit fault non-intrusively,effectively and simply,which made up the short-coming of traditional methods.The working principle,system component and working process of this tester were introduced.The FOV of the infrared camera could be calculated accurately.Shading into process technique was used for thermal image fusion.Therefore,the best suitable FOV could be obtained according to the spatial resolution of the infrared camera,and the thermal image of circuits could be applied in fault diagnosis easily,and the result was satisfied.Therefore,it laid the groundwork for the smaller and more practial tester.
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