Technology of Electroless Copper Plating on ABS Plastics

YU Xiao-jiao,ZHANG Xun-ya,FAN Wei,YU Zhong

DOI: https://doi.org/10.3969/j.issn.1004-227x.2007.05.003

2007-01-01

Abstract:The process flow of electroless copper plating on ABS plastics was introduced, and the effects of roughening temperature and time, sensitizing and activating time, contents of copper sulfate, formaldehyde, potassium sodium tartrate, temperature and solution pH on electroless plating rate and qualities of electroless plating layer were discussed. The optimal technological conditions of electroless copper deposition are determined as follows: 15 ~ 20 g/L copper sulfate, 15 mL/L formaldehyde, 14 g/L potassium sodium tartrate, temperature 323 K and pH of plating solution 11 ~ 12. The SEM photo shows that the plating layer is even and bright and has good adhesion.