Abstract:In order to achieve highly dense integration in use of RF application, the hybrid switch array with RF unit and control unit has been designed, utilizing TSV and LTCC technology respectively. In this paper, the analyses of circuit design theory and fabrication process in switch array are illustrated. The process is developed to fabricate TSV interposer on thick high resistivity Si wafer. Fabrication of vias, RDL and bumps are correspondingly optimized through controlling the assisted approach. Afterwards, the stacking with high accuracy is performed assisted with optimized profile. All the test results show that the processing approach and the integrated unit have promising application prospect.

A HIGHLY DENSE TSV SWITCH ARRAY INTEGRATED WITH LTCC CONTROL UINT