Improving Aluminum Ultraviolet Plasmonic Activity through a 1 nm ta-C Film
Jie Wang,Zhenqiu Wu,Junhan Wei,Junzheng Hu,Huikang Yu,Guangxu Su,Lumang Hu,Xiaodong Yan,Peng Zhan,Fanxin Liu
DOI: https://doi.org/10.1021/acsami.0c18473
IF: 9.5
2021-01-01
ACS Applied Materials & Interfaces
Abstract:Aluminum (Al) can actively support plasmonic response in the ultraviolet (UV) range compared to noble metals (e.g., Au, Ag) and thus has broad applications including UV sensing, displays, and photovoltaics. High-quality Al films with no oxidation are essential and critical in these applications. However, Al is very prone to fast oxidation in air, which critically depends on the fabrication process. Here, we report that by leveraging the in situ sputter etching and sputter deposition of a 1 nm tetrahedral amorphous carbon (ta-C) film on the Al nanostructures, Al plasmonic activity can be improved. The prior sputter etching process greatly reduces the oxidized layer of the Al films, and the subsequent sputter deposition of ta-C keeps Al oxidation-free. The ta-C film outperforms the naturally passivated Al2O3 layer on the Al film because the ta-C film has a denser structure, higher permittivity, and better biocompatibility. Therefore, it can effectively improve the plasmonic response of Al and be beneficial to molecule sensing, which is proved in our experiments and is also verified in simulations. Our results can enable the various applications based on plasmon resonance in the UV range.