Research of thermal loads in plate forming coil during repeated electromagnetic forming process

Jiawei Wu,Lei Qiu,Qi Chen,Quanliang Cao,Xiaotao Han

DOI: https://doi.org/10.1109/I2MTC.2018.8409595

2018-01-01

Abstract:The thermal load of electromagnetic forming coil is one of the important factors affecting the long continuous service life of the coil. Study of thermal loads in forming coil during repeated EMF process is necessary before its industrialization, and is instructive to coil design. In this paper, several groups of repeated discharges experiments with two different coils were carried out. Fluorescence fiber measurement was applied in the experiments to acquire the coil temperature, and it was proved to be a suitable and promising method in measuring the temperature of electrical equipment. A finite element simulation model of plate forming coil has been established based on COMSOL Multiphysics. The experiment results showed good accordance with the simulation. The results proved that the coil reached an equilibrium temperature after a short period of time. By analyzing the equilibrium temperature, the effect of the crowbar circuit was verified, and a simple method of estimating coil temperature rise in repeated EMF processes based on discharge energy was proposed.