19-Fold Thermal Conductivity Increase of Carbon Nanotube Bundles Toward High-End Thermal Design Applications

Yangsu Xie,Tianyu Wang,Bowen Zhu,Chaoyi Yan,Peixin Zhang,Xinwei Wang,Gyula Eres
DOI: https://doi.org/10.1016/j.carbon.2018.07.009
IF: 10.9
2018-01-01
Carbon
Abstract:In high temperature annealing of carbon nanotube (CNTs) bundles for structure and thermal conductivity (k) improvement, the statistical errors from sample-wide structure variation and sample transfer/preparation significantly overshadows the understanding of structure-k correlation and change. In this work, the sequential process of current-induced thermal annealing (CITA) on improving the structure, electrical and thermal conductivities of chemical vapor deposition grown CNT bundles is studied for the first time. Our in-situ k measurement using the transient electro-thermal technique uncovers the conjugated dynamic electrical, thermal, and structural properties. The electrical resistance and thermal diffusivity evolution of CNT bundles during CITA is studied. The thermal diffusivity and k before and after CITA are measured from room temperature down to 10 K to uncover the reduction of defect density and enhancement of inter-tube connection strength after CITA. Our micro-Raman spectroscopy study from the most annealed region to the non-annealed region reveals significantly improved order in sp(2) bonding carbon structure and reduced defects along the sample length. The resulting K has 5-19 times increase at the most annealed region of CNT bundles. The intrinsic k of CNT walls against the annealing temperature is also determined, which reaches a level as high as 754 W/m.K after CITA. (C) 2018 Elsevier Ltd. All rights reserved.
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