Investigating the Manufacturing Process of Heat-Treated Nb3Sn-CICC Conductor for CFETR CSMC Modules
Yunhua Tong,Xiang Gao,Houxiang Han,Tiejun Xu,Yu Wu,Xiaoming Liu,Long Zhong,Siqing Fenga,Kaibing Si
DOI: https://doi.org/10.1109/tasc.2022.3225825
IF: 1.9489
2023-01-01
IEEE Transactions on Applied Superconductivity
Abstract:The center solenoid model coil (CSMC) of the China fusion engineering test reactor (CFETR) requires a high heat treatment temperature of 650 °C, which would destroy the insulation layer by carbonization and cause coil failure. To avoid this, using the manufacturing technology and routine process of the ITER center solenoid coil as a reference, in this article, a solution is introduced that is applied for manufacturing the CFETR CSMC module. The coil is heat treated before insulation and after winding. A single turn of the heat-treated coil is separated and the wrapping turn insulation is applied, and then the separated layers are reversed back into the integrated coil. To manufacture the integrated coils, the heat-treated coils are molded. After heat treatment, the interlayer separation distance of the Nb3Sn cable-in-conduit conductor in the coil should satisfy the allowable strain range of the superconductor, which is crucial for designing the rotational support structure of the interlayer separation. In addition, to achieve the accurate final shape of the coil and meet the design requirements, as well as to ensure coil contour accuracy after layer by layer separation, the antideformation ability of the coil mold is a key research topic. Herein, mechanical properties of the key components were optimized and numerical calculations and ANSYS simulations were used for statistical analyses. Results from the analyses indicated that the equivalent stress on the device is less than the maximum permissible stress of the raw material. The device was manufactured and compared with a design mold. The overall deformation error was <5%, movement error of the electric frame was <2%, rotation error of rotating was less than ±1° per 360°, levelness between the upper and lower platform was <1 mm, and motion error was less than ±1 mm per 100 mm. These results demonstrated the optimized structure design of the device. In the as-obtained device, the coil could separate a single turn and wrapping turn insulation could be applied. Parameters of the manufactured coil satisfied all the CSMC design requirements; these results indicate that the proposed device is suitable for manufacturing the CFETR CSMC module coil.