Abstract:In the past decade, the feature size in ultra large-scale integration (ULSI) has been continuously decreasing, leading to nanostructure fabrication. Nowadays, various lithographic techniques ranging from conventional methods (e.g. photolithography, x-rays) to unconventional ones (e.g. nanoimprint lithography, self-assembled monolayers) are used to create small features. Among all these, resist-based electron beam lithography (EBL) seems to be the most suitable technique when nanostructures are desired. The achievement of sub-20-nm structures using EBL is a very sensitive process determined by various factors, starting with the choice of resist material and ending with the development process. After a short introduction to nanolithography, a framework for the nanofabrication process is presented. To obtain finer patterns, improvements of the material properties of the resist are very important. The present review gives an overview of the best resolution obtained with several types of both organic and inorganic resists. For each resist, the advantages and disadvantages are presented. Although very small features (2-5 nm) have been obtained with PMMA and inorganic metal halides, for the former resist the low etch resistance and instability of the pattern, and for the latter the delicate handling of the samples and the difficulties encountered in the spinning session, prevent the wider use of these e-beam resists in nanostructure fabrication. A relatively new e-beam resist, hydrogen silsesquioxane (HSQ), is very suitable when aiming for sub-20-nm resolution. The changes that this resist undergoes before, during and after electron beam exposure are discussed and the influence of various parameters (e.g. pre-baking, exposure dose, writing strategy, development process) on the resolution is presented. In general, high resolution can be obtained using ultrathin resist layers and when the exposure is performed at high acceleration voltages. Usually, one of the properties of the resist material is improved to the detriment of another. It has been demonstrated that aging, baking at low temperature, immediate exposure after spin coating, the use of a weak developer and development at a low temperature increase the sensitivity but decrease the contrast. The surface roughness is more pronounced at low exposure doses (high sensitivity) and high baking temperatures. A delay between exposure and development seems to increase both contrast and the sensitivity of samples which are stored in a vacuum after exposure, compared to those stored in air. Due to its relative novelty, the capabilities of HSQ have not been completely explored, hence there is still room for improvement. Applications of this electron beam resist in lithographic techniques other than EBL are also discussed. Finally, conclusions and an outlook are presented.

Water-Based Photo- and Electron-Beam Lithography Using Egg White As A Resist

Rapid Prototyping of Soft Lithography Masters for Microfluidic Devices Using Dry Film Photoresist in a Non-Cleanroom Setting

Solvent-Free Nanofabrication Based on Ice-Assisted Electron-Beam Lithography.

Three-Dimensional in Situ Electron-Beam Lithography Using Water Ice.

All-Water Etching-Free Electron Beam Lithography for On-Chip Nanomaterials

CO2‐Based Dual‐Tone Resists for Electron Beam Lithography

Advanced lithography materials: From fundamentals to applications

Nanoscale Bilayer Mechanical Lithography Using Water as Developer

Wool Keratin Photolithography As an Eco-Friendly Route to Fabricate Protein Microarchitectures.

Towards environmentally friendly processing of ionic liquid based photoresist with a boosted lithography performance

Electrohydrodynamic Direct-Writing Lithography: an Alternative Maskless Technique for Microstructure Fabrication

Sustainable Lithography Paradigm Enabled by Mechanically Peelable Resists

A low-cost fabrication method of nanostructures by ultraviolet proximity exposing lithography

Direct patterning using protein-based water lithography

Multi‐ and Gray‐Scale Thermal Lithography of Silk Fibroin as Water‐Developable Resist for Micro and Nanofabrication

Aqueous Multiphoton Lithography with Multifunctional Silk-Centred Bio-Resists

Water Lithography: from Programmable Printing to Functional Patterning

Effective Optimization Strategy for Electron Beam Lithography of Molecular Glass Negative Photoresist

Atom Lithography: Fabricating Arrays of Silicon Microstructures Using Self-Assembled Monolayer Resist and Metastable Helium Beam

Simple Isopropanol-Assisted Direct Soft Imprint Lithography for Residue-Free Microstructure Patterning.

Resists for sub-20-nm electron beam lithography with a focus on HSQ: state of the art