Rapid 3d Reconstruction Based on Color Fringe Projection

Du Juan,Tan Jiansheng,Hu Yueming,Chen Ya
DOI: https://doi.org/10.1109/chicc.2016.7553973
2016-01-01
Abstract:A rapid 3D reconstruction method for IC chips based on color fringe projection is proposed in this paper. In the defect inspection of IC chips, the present methods of 3D reconstruction can't meet the requirement of high speed and high accuracy. In this paper, periodic color fringe patterns are designed for the projection. The relationship between fringe pattern offset and surface height of the object can be obtained from the mathematical model of the color fringe projection system. A new method using the duty ratio is proposed to calculate the fringe pattern offset. Only a single fringe image is needed to realize the 3D reconstruction of IC chips. Experimental results show that the proposed method can realize real time 3D reconstruction and obtain the 3D information accurately.
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