Abstract:The interfacial reactions induced by vacuum furnace annealing and rapid thermal annealing in sequentially deposited Al/Ni bimetallic thin-film diffusion couples have been investigated with MeV 4He+ backscattering spectrometry, cross-sectional transmission electron microscopy, and Auger electron spectroscopy. Upon annealing, NiAl3 is the first aluminide phase to grow. In uncontaminated samples, the NiAl3 growth proceeds in uniform planar fashion, governed by diffusion-limited kinetics. The kinetics data fit well with those for NiAl3 growth on large-grained Al substrates, yielding a common kinetics law of x2=kt, where x is the thickness of the NiAl3 grown at the interface, t is the annealing duration, and k is the growth constant, which is given by k=2.24(cm2/s) exp(−1.5±0.1 eV/kBT), in which T is the annealing temperature and kB is the Boltzmann constant. Microscopic examination reveals slight nonuniformity at the Al/NiAl3 interface resulting from shallow local protrusions of NiAl3 grains into the Al layer at grain boundaries. When either the Al film or the Al/Ni interface is purposely contaminated during sample preparation, the roughness at this Al/NiAl3 interface becomes very pronounced, and the reaction rate is significantly reduced. Meanwhile, Ni motion becomes appreciable as NiAl3 grains and/or Ni severely penetrate the Al layer. In contrast, the NiAl3/Ni interface remains sharp in all samples. The irregular morphology and nonuniform reaction cannot be attributed uniquely to the presence of grain boundaries in the Al film, but rather are a combined effect of impurities and Al grain boundaries. Short-term rapid thermal annealing at elevated temperatures appreciably alleviates the nonuniformity at the Al/NiAl3 interface in contaminated samples.

Cross-sectional Characterization of the Dewetting of a Au/Ni Bilayer Film.

Formation of Au, Pt, and bimetallic Au–Pt nanostructures from thermal dewetting of single-layer or bilayer thin films

Monitoring morphological and chemical properties during silver solid-state dewetting

Electrochemical study and structural comparison of Ni electrodepositions on W/Si and Cr/C multilayered structure films

Dewetting of Polymer Films with Built-In Topographical Defects

Rupturing of Polymer Films with Rubbing-Induced Surface Defects

Temperature-dependent electron microscopy study of Au thin films on Si (100) with and without native oxide layer as barrier at the interface

A Molecular Dynamics Study of Ag-Ni Nanometric Multilayers: Thermal Behavior and Stability

Nial3 Formation in Al/Ni Thin-Film Bilayers with and Without Contamination

Growth and Characterization of Au, Ni and Au–Ni Nanoclusters on 6H-Sic(0001) Carbon Nanomesh

In Situ Observation of Structural and Optical Changes of Phase-Separated Ag-Cu Nanoparticles during a Dewetting Process via Transmission Electron Microscopy

Control of Self-Assembly and Elemental Mixing of AuNi Bimetallic Nanoparticles via Solid-State and Liquid-State Dewetting of Metal Thin Films

Thickness Mediated Morphology Evolution in Sub-10-nm Metal Film Deposition: Implications for Nondestructive Testing

Study of NiSi/Si Interface by Cross-Section Transmission Electron Microscopy

The formation of heterointerface defects in Au/Cu films on Si substrates under direct current in a vacuum ultraviolet environment.

Evolution of Interface Microstructure and Tensile Properties of AgPd30/CuNi18Zn26 Bilayer Laminated Composite Manufactured by Rolling and Annealing

The atomic and electronic structures of NiO(001)∕Au(001) interfaces

Nanoscale analysis of ultrasonic wedge bond interface by using high-resolution transmission electron microscopy

Structural properties of Fe-Ni/Cu/Fe-Ni trilayers on Si (100)

In-situ observation of transition between surface relief and wrinkling in thin film shape memory alloys.

Molecular Dynamics Study on Structural and Atomic Evolution Between Au and Ni Nanoparticles Through Coalescence