RF MEMS Package Technology in Wireless Systems

付佳辉,吴群,顾学迈,秦月梅
DOI: https://doi.org/10.3969/j.issn.1005-9490.2004.01.051
2004-01-01
Abstract:MEMS technology shows attractive electrical characteristics that are critically needed in the next generation RF wireless systems with low power consumption and high data rate. The researcher should consider the MEMS package at earlier stages in product development, so as to reduce the cost and improve the yield of the products. Aceording to the conflict between elements of RF MEMS and design of package in process, This paper describes the state - of - the-art MEMS package technology for RF applications, and proposes the importance and realization approach to the design of the products. Particularly, computer simulation design concept for RF MEMS elements and circuit package is emphasized.
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