Electromagnetic Shielding Effectiveness and Serviceability of the Multilayer Structured Cuprammonium Fabric/polypyrrole/copper (cf/ppy/cu) Composite

Hang Zhao,Lei Hou,Yinxiang Lu
DOI: https://doi.org/10.1016/j.cej.2016.04.004
IF: 15.1
2016-01-01
Chemical Engineering Journal
Abstract:In this paper, we developed a simple and robust synthesis route to fabricate multilayer structured cuprammonium fabric/polypyrrole/copper (CF/PPy/Cu) composite, which could be potentially used as electromagnetic interference (EMI) shield due to its characteristics of both EM wave-absorption and EM wave-reflection. PPy layer was directly deposited onto the bare CF substrate via an in-situ polymerization approach, and the interaction mechanism between PPy and CF substrate was investigated by FT-IR and FT-Raman measurements. The results indicated that the interaction between PPy (-N-H) and CF (>C-OH) substrate was by hydrogen bonding. Afterwards, Cu film was constructed on the as made PPy coated CF (CF/PPy) by an electroless copper plating method. The elemental analysis of the samples in each step was conducted by using XPS measurement. XRD analysis showed that the top Cu film had a characteristic face-centered cubic (FCC) crystalline structure. SEM images illustrated that the thickness of the PPy film was about 1.52 mu m with 11.4% deviation, which was enough to generate the inter-fiber connection. Moreover, the probable growth mechanism of top-Cu films was proposed according to their surface morphologies. The shielding effectiveness (SE) values of copper plated CF (CF/Cu) and CF/PPy/Cu were recorded and compared by using a Spectrum analyzer (30-1000 MHz). The resultant CF/PPy/Cu composite had a higher EMI SE (30.3-50.4 dB) with sheet resistance of 85.8 m Omega/sq. The results of ultrasonic washing, TGA and tensile measurements revealed that the proposed conductive fabric exhibited an excellent serviceability, which was adequately reliable for practical application. (C) 2016 Elsevier B.V. All rights reserved.
What problem does this paper attempt to address?