High aspect-ratio 3D microstructures via near-field electrospinning for energy storage applications

Guoxi Luo,Kwok Siong Teh,Xining Zang,Dezhi Wu,Zhiyu Wen,Liwei Lin
DOI: https://doi.org/10.1109/MEMSYS.2016.7421549
2016-01-01
Abstract:High-aspect-ratio, three dimensional (3D) microstructures have been constructed by a direct-write method via self-aligned near-field electrospinning process. Using papers as the collectors, the process enables both design and fabrication of a variety of 3D structures, such as walls, grids and other configurations based on layer-by-layer deposition of electrospun micro/nano fibers. Afterwards, these fabricated polymeric structures can be mechanically separated from the paper substrate for various applications. In this work, we have successfully fabricated 20-layer, ca. 100 μm in thickness, 2 × 2 cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> 3D grid-structures made of PVDF (Polyvinylidene fluoride) electrospun fibers. After a coating process using the dip-and-dry process in the CNT (carbon nanotube) ink, conductive and flexible electrodes made of CNT coated polymer grid-structures have been demonstrated and assembled as a micro-supercapacitor.
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