Abstract:Polyimide (PI) is an essential substrate or packaging material for various electronic devices. The decreased packaging size and high integration in electronic systems have caused the issue of heat accumulation issue. However, the intrinsic low thermal conductivity of PI cannot meet the requirements of certain electronic systems. Herein, we report a facile and effective approach to fabricating highly thermally conductive polyimide (PI)-based composites by constructing 3D nanofiller segregated networks in the matrix and realizing reduced interfacial thermal resistance between adjacent nanofillers. First, a water-soluble poly(amic acid) tertiary amine salt was utilized as a surfactant to facilitate the dispersion of hydrophobic boron nitride nanosheets (BNNS) in aqueous phase. Then, a combination of the ice-templating strategy and a hot-pressing treatment was applied to control the oriented distribution of BNNS, and the silver nanowires (AgNW) were incorporated and acted as "thermally conductive bridges", resulting in an obvious decrease of thermal interfacial resistance and forming an interconnected thermally conductive expressway. Thus, a significant improvement in the thermal conductivity was achieved. The resultant nanocomposite with 20 wt% BNNS-AgNW exhibited an in-plane thermal conductivity of 4.75 W m−1 K−1, corresponding to a thermal conductivity enhancement of 324%, which is much superior to those of the pure PI and the random distribution composites. These nanocomposites present an excellent electrically insulation property and good dielectric behavior as well as improved dimensional stability. This facile methodology is believed to afford PI-based materials broad application potential used as thermal interface materials in next generation electronic devices.

Highly Thermally Conductive Polyimide Composites Via Constructing 3D Networks.

Highly anisotropic thermally conductive polyimide composites via the alignment of boron nitride platelets

Largely improved thermal conductivity of PI/BNNS nanocomposites obtained by constructing a 3D BNNS network and filling it with AgNW as the thermally conductive bridges

Isotropically Ultrahigh Thermal Conductive Polymer Composites by Assembling Anisotropic Boron Nitride Nanosheets into a Biaxially Oriented Network.

Preparation of highly thermally conductive and electrically insulating PI/BNNSs nanocomposites by hot-pressing self-assembled PI/BNNSs microspheres

Dielectric Polyimide Composites with Enhanced Thermal Conductivity and Excellent Electrical Insulation Properties by Constructing 3D Oriented Heat Transfer Network

A Novel Three-Dimensional Boron Phosphide Network for Thermal Management of Epoxy Composites

Highly thermally conductive polymer composite enhanced by constructing a dual thermal conductivity network

Greatly enhanced thermal conductivity of polyimide composites by polydopamine modification and the 2D-aligned structure

Highly thermally conductive polymer composite enhanced by two-level adjustable boron nitride network with leaf venation structure

The thermal conductivity of 3D network reinforced polypropylene matrix composites was constructed by the pickering‐like emulsion method

Recent progress in thermally conductive polymer/boron nitride composites by constructing three-dimensional networks

Construction of 3D BN network with high-density thermal conductive paths

Highly thermally conductive polystyrene/polypropylene/boron nitride composites with 3D segregated structure prepared by solution-mixing and hot-pressing method

Constructing three‐dimensional boron nitride network for highly thermally conductive epoxy resin composites

Polyimide Composites with Fluorinated Graphene and Functionalized Boron Nitride Nanosheets for Heat Dissipation

Formation of thermally conductive networks in isotactic polypropylene/hexagonal boron nitride composites via “Bridge Effect” of multi-wall carbon nanotubes and graphene nanoplatelets

Vacuum filtration-assisted design of hierarchical structure in polyimide-BN composite films: Toward enhanced thermal conductivity, low dielectric and electrical insulation

Enhanced thermal conductivity by constructing 3D-networks in poly (vinylidene fluoride) composites via positively charged hexagonal boron nitride and silica coated carbon nanotubes

Synergistic Improvement in Thermal Conductivity of Polyimide Nanocomposite Films Using Boron Nitride Coated Copper Nanoparticles and Nanowires

Covalent-assisted Construction of “Scale-Like” Boron Nitride/polyimide Thermal Interface Materials with High Thermal Conductivity