Fracture Analysis of Cracked Equilateral Triangular Hole with Surface Elasticity Effect Under Antiplane Shear
Xiao Junhua,Han Bin,Xu Yaoling,Zhang Fucheng
DOI: https://doi.org/10.19636/j.cnki.cjsm42-1250/o3.2017.014
2017-01-01
Abstract:Engineering structures and mechanical parts often contain hole defects,such as bolt holes,rivet holes,groove holes,weight loss holes,etc.Under extreme loads and severe service conditions (e.g.high temperature,high speed and vibration),they are prone to stress concentration phenomena and fatigue cracks along the holes.Therefore,it is of practical significance to study the fracture behavior for the problems of cracked holes.When the size of cracked hole is on the order of nanometer,the surface effect plays an important role in the elastic field around the defects (hole and crack).In this work,based on the theory of Gurtin-Murdoch surface model and a conformal mapping technique,a theoretical study is conducted on the fracture behavior of cracked equilateral triangular hole with surface elasticity effect under far-field antiplane shear.An exact solution of the whole-field stress around the triangular hole is presented.An analytical solution for the stress intensity factors at the crack tips is obtained.Numerical examples are provided to discuss the variation of the dimensionless stress intensity factor with size of the triangular hole,length of crack and surface property.The major results show that when the size of triangular hole is on the nanometer scale,the dimensionless stress intensity factor exhibits a significant size effect.The present solution approaches the classical fracture theory with the increase of the size of triangular hole.With the increase of crack length,the stress intensity factor first increases,then decreases.When the length of crack is small,surface effect of the defect is quite weak.The size-dependent effect of the stress intensity factor is significantly affected by the surface property.The exact solution presented is helpful in understanding the fracture behavior of cracked holes in nanoscale and the structural integrity assessment.