Cu3Mo2O9: an Ultralow-Firing Microwave Dielectric Ceramic with Good Temperature Stability and Chemical Compatibility with Aluminum

Wangxi Wen,Chunchun Li,Yihua Sun,Ying Tang,Liang Fang
DOI: https://doi.org/10.1007/s11664-017-5957-z
IF: 2.1
2017-01-01
Journal of Electronic Materials
Abstract:An ultralow-firing microwave dielectric ceramic Cu3Mo2O9 with orthorhombic structure has been fabricated via a solid-state reaction method. X-ray diffraction analysis, Rietveld refinement, Raman spectroscopy, energy-dispersive spectrometry, and scanning electron microscopy were employed to explore the phase purity, crystal structure, and microstructure. Pure and dense Cu3Mo2O9 ceramics could be obtained in the sintering temperature range from 580°C to 680°C. The sample sintered at 660°C for 4 h exhibited the highest relative density (∼ 97.2%) and best microwave dielectric properties with ε r = 7.2, Q × f = 19,300 GHz, and τ f = − 7.8 ppm/°C. Chemical compatibility with aluminum electrodes was also confirmed. All the results suggest that Cu3Mo2O9 ceramic is a promising candidate for use in ultralow-temperature cofired ceramic applications.
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