Abstract:Demands for neural interfaces around functionality, high spatial resolution, and longevity have recently increased. These requirements can be met with sophisticated silicon-based integrated circuits. Embedding miniaturized dice in flexible polymer substrates significantly improves their adaptation to the mechanical environment in the body, thus improving the systems' structural biocompatibility and ability to cover larger areas of the brain. This work addresses the main challenges in developing a hybrid chip-in-foil neural implant. Assessments considered (1) the mechanical compliance to the recipient tissue that allows a long-term application and (2) the suitable design that allows the implant's scaling and modular adaptation of chip arrangement. Finite element model studies were performed to identify design rules regarding die geometry, interconnect routing, and positions for contact pads on dice. Providing edge fillets in the die base shape proved an effective measure to improve die-substrate integrity and increase the area available for contact pads. Furthermore, routing of interconnects in the immediate vicinity of die corners should be avoided, as the substrate in these areas is prone to mechanical stress concentration. Contact pads on dice should be placed with a clearance from the die rim to avoid delamination when the implant conforms to a curvilinear body. A microfabrication process was developed to transfer, align, and electrically interconnect multiple dice into conformable polyimide-based substrates. The process enabled arbitrary die shape and size over independent target positions on the conformable substrate based on the die position on the fabrication wafer.

Integrated Devices for Micro-Package Integrity Monitoring in mm-Scale Neural Implants.

The Packaging of Implantable Integrated Sensors

Micro Package Of Short Term Wireless Implantable Microfabricated Systems

Study of Package Technologies for Implantable Microdevices

Polymeric Packaging for Fully Implantable Wireless Neural Microsensors

A Test Microchip for Evaluation of Hermetic Packaging Technology for Biomedical Prosthetic Implants

Optical monitoring of water side permeation in thin film encapsulation

Wireless, battery-free, and real-time monitoring of water permeation across thin-film encapsulation

Longevity of Implantable Silicon-ICs for Emerging Neural Applications: Evaluation of Bare Die and PDMS-Coated ICs After Accelerated Aging and Implantation Studies

Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices

Microscopic Characterization of Failure Mechanisms in Long-Term Implanted Microwire Neural Electrodes

Developing Clinical Grade Flexible Implantable Electronics

A High Reliability CMOS Implantable Interface for Wireless Neural Recording Microsystem

A polymer-metal two step sealing concept for hermetic neural implant packages

Highly conformable chip-in-foil implants for neural applications

Automated and Wireless Accelerated Heat Soak Testing System to Assess Hermetic Failure Mechanism of Inductively Powered Implantable Medical Applications

Microwave Imaging for the Integrity Assessment of IC Packages

Hermetic and Bioresorbable Packaging Materials for MEMS Implantable Pressure Sensors: A Review

A novel packaging technology for miniaturization of active long-term implantable medical devices enabling new medical applications

Ultrathin, High Capacitance Capping Layers for Silicon Electronics with Conductive Interconnects in Flexible, Long‐Lived Bioimplants

Polymer-Based Biocompatible Packaging for Implantable Devices: Packaging Method, Materials, and Reliability Simulation