Rapid Copper Metallization of Textile Materials: a Controlled Two-Step Route to Achieve User-Defined Patterns under Ambient Conditions.

Shuang-Yuan Zhang,Guijian Guan,Shan Jiang,Hongchen Guo,Jing Xia,Michelle D. Regulacio,Mingda Wu,Kwok Wei Shah,Zhili Dong,Jie Zhang,Ming-Yong Han
DOI: https://doi.org/10.1021/acsami.5b06807
IF: 9.5
2015-01-01
ACS Applied Materials & Interfaces
Abstract:Throughout history earth-abundant copper has been incorporated into textiles and it still caters to various needs in modern society. In this paper, we present a two-step copper metallization strategy to realize sequentially nondiffusive copper(II) patterning and rapid copper deposition on various textile materials, including cotton, polyester, nylon, and their mixtures. A new, cost-effective formulation is designed to minimize the copper pattern migration on textiles and to achieve user-defined copper patterns. The metallized copper is found to be very adhesive and stable against washing and oxidation. Furthermore, the copper-metallized textile exhibits excellent electrical conductivity that is ~3 times better than that of stainless steel and also inhibits the growth of bacteria effectively. This new copper metallization approach holds great promise as a commercially viable method to metallize an insulating textile, opening up research avenues for wearable electronics and functional garments.
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