Abstract:Wafer‐level Sapphire and Si are integrated by ultrafast laser plasmonic microwelding. Controlled spatial energy input and synergistic materials evolution allow the joint formation with low damage and high performance. Heterogeneous junction with insertion of Ag nanoparticles (NPs) layer shows robust strength and excellent impermeability even after thermal shocking (−40 °C to 120 °C) for 200 cycles. Integration of wafer‐scale oxide and semiconductor materials meets the difficulties of residual stress and materials incompatibility. In this work, Ag NPs thin film is contributed as an energy confinement layer between oxide (Sapphire) and semiconductor (Si) wafers to localize the materials interaction during ultrafast laser irradiation. Due to the plasmonic effects generated within constructed dielectric–metal–dielectric structures (i.e., Sapphire–Ag–Si), thermal diffusion and chemical reaction between Ag and its neighboring materials facilitate the microwelding of Sapphire and Si wafers. Ag NPs can be totally sintered within the junction area to bridge oxide and semiconductor, while Al─O─Ag bond and Ag─Si bond are formed at Ag–Sapphire and Ag─Si interfaces, respectively. As‐received heterogeneous joint exhibits a high shear strength up to 5.4 MPa, with the fracture occurring inside Si wafer. Meanwhile, insertion of metal nanolayer can greatly relieve the residual stress‐induced microcracking inside the brittle materials. Such wafer‐scale Sapphire and Si interconnects thus show robust strength and excellent impermeability even after thermal shocking (−40 °C to 120 °C) for 200 cycles. This metal NPs layer‐assisted plasmonic microwelding technology can extend to broad materials integration, which is promising for high‐performance microdevices development in MEMS, MOEMS, or microfluidics.

Interface Modification Based Ultrashort Laser Microwelding Between SiC and Fused Silica.

Mechanism and optimization of femtosecond laser welding fused silica and aluminum

Microwelding of Glass to Silicon by Green Ultrafast Laser Pulses

The characteristics and dynamics of fused silica-aluminum alloy welding during mJ-level femtosecond laser

Direct joining of quartz glass and copper by nanosecond laser

Ultrafast Laser Welding of Silicon

Realization of Joints of Aluminosilicate Glass and 6061 Aluminum Alloy via Picosecond Laser Welding without Optical Contact

High-Strength Welding of Silica Glass Using Double-Pulse Femtosecond Laser under Non-Optical Contact Conditions

Femtosecond laser surface modification-based brazing of Si3N4 ceramics to 7A52 aluminum alloy

Micro-welding of non-optical contact sapphire/metal using Burst femtosecond laser

Enhanced joint through significant diffusion and molten pool regions in fused silica to aluminum alloy welding by femtosecond mJ-pulses

The mechanism of the welding between silica glass and 304 stainless steel using nanosecond fibre laser

Metal Nanoparticles Assisted Ultrafast Laser Plasmonic Microwelding of Oxide–Semiconductor Interconnects

Transmission Laser Welding of Similar and Dissimilar Semiconductor Materials

Characterization of Si–Cu–C–Al quaternary interface of SiC/2A14 joint via counterintuitive laser butt welding

Microstructure Evolution and Mechanical Properties of 20%SiCp/Al Joint Prepared via Laser Welding

Micro-welding of sapphire and metal by femtosecond laser

New insight into laser butt welded nonporous SiCp/2A14Al joint: Interfaces, precipitation phase and mechanical properties

Direct welding of dissimilar ceramics YSZ/Sapphire via nanosecond laser pulses

Improved Femtosecond Laser Welding of Nonoptical Contact Glass by Pressure and a Water Intermediate Layer

Glass to aluminum joining by forming a mechanical pin structure using femtosecond laser