Abstract:The central element of a phased array antenna that performs beam electrical scanning, as well as signal transmission and reception, is the transceiver (T/R) module. Higher standards have been set for the integration, volume, power consumption, stability, and environmental adaptability of T/R modules due to the increased operating frequency of phased array antennas, the variability of application platforms, and the diversified development of system functions. Device-based multichannel T/R modules are the key to realizing low-profile Ka-band phased array antenna microsystem architecture. The design and implementation of a low-profile, high-performance, and highly integrated Ka-band phased array antenna T/R module are examined in this paper. Additionally, a dependable Ka-band four-channel T/R module based on Si/GaAs/Low Temperature Co-fired Ceramic (LTCC), applying multi-material heterogeneous integration architecture, is proposed and fabricated. The chip architecture, transceiver link, LTCC substrates, interconnect interface, and packaging are all taken into consideration when designing the T/R module. When compared to a standard phased array antenna, the module's profile shrunk from 40 mm to 8 mm, and its overall dimensions are only 10.8 mm × 10 mm × 3 mm. It weighs 1 g, and with the same specs, the single channel volume was reduced by 95%. The T/R module has an output power of ≥26 dBm for single-channel transmission, an efficiency of ≥25%, and a noise factor of ≤4.4 dB. When compared to T/R modules based on System-on-Chip (SOC) devices, the RF performance has significantly improved, as seen by an increase in single channel output power and a decrease in the receiving noise factor. This work lays a foundation for the devitalization and engineering application of T/R modules in highly reliable application scenarios.

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