A Design Method of Multiple Protocols Communication Module in Semiconductor Equipment Simulation Platform
Wei Wang,Longqing Zou,Hua Xu,Youwei An,Peifa Jia,Bo Li,Yuan Luo
DOI: https://doi.org/10.4028/www.scientific.net/amr.462.516
2012-01-01
Advanced Materials Research
Abstract:This paper presents a design method for communication module design in semiconductor equipment simulation platform. There are several kinds of standardized protocols in semiconductor equipments intra communication, the method with which these standardized protocols can be configured and integrated in single simulation platform. These protocols can be configured statically and dynamically respectively. In static state, protocol configuration provides various protocols for chosen and edit. In the dynamic state, the virtual devices can be communicated with control system with communication module. As a case study, a process chamber system simulator with designed the communication module has been illustrated. The designed communication module accomplishes the data transmission between control system and the chamber simulation system. The devices in chamber system receive the instruction form control system and execute the required actions. The experiment results show that the simulation platform is feasible and effective.